- Manufacture :
- Pitch - Mating :
- Number of Positions or Pins (Grid) :
13 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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1,267
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3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,639
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3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
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3,287
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3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 18 (2 x 9) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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1,809
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 16 (2 x 8) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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1,560
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,685
Ships today + free overnight shipping
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 16 (2 x 8) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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783
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3M | CONN SOCKET SOIC 14POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 14 (2 x 7) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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1,305
Ships today + free overnight shipping
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3M | CONN SOCKET SOIC 24POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 24 (2 x 12) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,716
Ships today + free overnight shipping
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3M | CONN SOCKET SOIC 20POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 20 (2 x 10) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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3,100
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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657
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Texas Instruments | CONN TRANSIST TO-3 8POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Polyester, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 8 (Oval) | Beryllium Copper | - | 200.0µin (5.08µm) | Brass | |||
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1,992
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3M | CONN TRANSIST TO-3/TO-66 3POS | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 and TO-66 | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 30.0µin (0.76µm) | Gold | 3 (Rectangular) | Beryllium Copper | 0.234" (5.94mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
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3,864
Ships today + free overnight shipping
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3M | CONN SOCKET SOIC 8POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper |
