- Features :
8 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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951
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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1,299
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,576
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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1,950
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,798
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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2,244
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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1,802
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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2,837
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass |
