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70 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
Default Photo
40-6552-16
Per Unit
$36.88
RFQ
3,259
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6551-16
Per Unit
$36.88
RFQ
3,354
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3553-16
Per Unit
$36.88
RFQ
2,831
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3552-16
Per Unit
$36.88
RFQ
3,847
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3551-16
Per Unit
$36.88
RFQ
2,874
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6556-41
Per Unit
$35.75
RFQ
1,057
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
36-6553-18
Per Unit
$66.77
RFQ
1,612
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3554-16
Per Unit
$40.49
RFQ
1,109
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6554-16
Per Unit
$40.49
RFQ
1,509
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6556-40
Per Unit
$32.74
RFQ
3,755
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
40-6575-16
Per Unit
$32.23
RFQ
3,394
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6573-16
Per Unit
$32.23
RFQ
3,342
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6572-16
Per Unit
$32.23
RFQ
3,905
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6571-16
Per Unit
$32.23
RFQ
3,534
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel Beryllium Nickel
Default Photo
40-6570-16
Per Unit
$32.23
RFQ
3,188
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel Beryllium Nickel
Default Photo
40-3575-16
Per Unit
$32.23
RFQ
1,662
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3573-16
Per Unit
$32.23
RFQ
2,121
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel Beryllium Nickel
Default Photo
40-3572-16
Per Unit
$32.23
RFQ
922
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel Beryllium Nickel
Default Photo
40-3571-16
Per Unit
$32.23
RFQ
3,320
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel Beryllium Nickel
Default Photo
40-3570-16
Per Unit
$32.23
RFQ
2,535
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel Beryllium Nickel
Default Photo
40-6574-16
Per Unit
$32.23
RFQ
2,948
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3574-16
Per Unit
$32.23
RFQ
1,876
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3554-11
Per Unit
$16.10
RFQ
2,115
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6556-21
Per Unit
$18.31
RFQ
3,493
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper Brass
Default Photo
40-6575-18
Per Unit
$98.49
RFQ
1,339
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3575-18
Per Unit
$98.49
RFQ
1,918
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6574-18
Per Unit
$98.49
RFQ
1,084
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-3574-18
Per Unit
$98.49
RFQ
2,259
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6575-11
Per Unit
$19.26
RFQ
2,801
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
Default Photo
40-6572-11
Per Unit
$19.26
RFQ
3,052
Ships today + free overnight shipping
 Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper Beryllium Copper
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