- Series :
- Operating Temperature :
- Mounting Type :
- Features :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
8 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,286
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CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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3,457
Ships today + free overnight shipping
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On Shore Technology Inc. | CONN IC DIP SOCKET 20POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 20 (2 x 10) | Beryllium Copper | Brass | |||
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2,636
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 20 (2 x 10) | Beryllium Copper | Beryllium Copper | |||
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2,534
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 20 (2 x 10) | Beryllium Copper | Beryllium Copper | |||
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1,456
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | Beryllium Copper | |||
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1,191
Ships today + free overnight shipping
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CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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2,918
Ships today + free overnight shipping
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CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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998
Ships today + free overnight shipping
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On Shore Technology Inc. | CONN IC DIP SOCKET 20POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze |
