Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
65 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$57.48
RFQ
1,396
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Samtec Inc. CONN ADAPTER PLUG 28POS GOLD APA Active Bulk - Through Hole Solder Open Frame - Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 28 (2 x 14) Phosphor Bronze 20.0µin (0.51µm) Phosphor Bronze
Default Photo
Per Unit
$5.96
RFQ
3,885
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$4.29
RFQ
3,427
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$4.05
RFQ
3,927
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.91
RFQ
3,264
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$2.66
RFQ
3,026
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
BU280Z-178-HT
Per Unit
$2.60
RFQ
2,920
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 28POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 28 (2 x 14) Beryllium Copper Flash Brass
Default Photo
Per Unit
$2.44
RFQ
2,188
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 16 (2 x 8) Beryllium Copper Flash Beryllium Copper
Default Photo
Per Unit
$2.41
RFQ
3,942
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 16 (2 x 8) Beryllium Copper Flash Beryllium Copper
BU480Z-178-HT
Per Unit
$6.27
RFQ
925
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 48POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 48 (2 x 24) Beryllium Copper Flash Brass
Default Photo
Per Unit
$0.48
RFQ
1,188
Ships today + free overnight shipping
Assmann WSW Components CONN IC DIP SOCKET 10POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper Flash Brass
Default Photo
Per Unit
$0.48
RFQ
2,508
Ships today + free overnight shipping
On Shore Technology Inc. CONN SOCKET SIP 13POS GOLD SBU Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
Per Unit
$0.47
RFQ
1,608
Ships today + free overnight shipping
CNC Tech CONN SOCKET PLCC 20POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Gold - Gold 20 (4 x 5) Phosphor Bronze - Phosphor Bronze
Default Photo
Per Unit
$4.79
RFQ
1,221
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$4.68
RFQ
2,824
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.58
RFQ
3,459
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.53
RFQ
3,863
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$4.38
RFQ
2,585
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
BU400Z-178-HT
Per Unit
$6.28
RFQ
1,247
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 40POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 40 (2 x 20) Beryllium Copper Flash Brass
XR2A-2411-N
Per Unit
$3.15
RFQ
3,819
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
BU200Z-178-HT
Per Unit
$2.88
RFQ
3,457
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 20 (2 x 10) Beryllium Copper Flash Brass
BU240Z-178-HT
Per Unit
$2.66
RFQ
3,468
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 24POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 24 (2 x 12) Beryllium Copper Flash Brass
BU160Z-178-HT
Per Unit
$2.13
RFQ
3,338
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 16POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 16 (2 x 8) Beryllium Copper Flash Brass
BU060Z-178-HT
Per Unit
$1.00
RFQ
2,255
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 6POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 6 (2 x 3) Beryllium Copper Flash Brass
XR2A-0802
Per Unit
$2.44
RFQ
3,876
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 8 (2 x 4) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
BU080Z-178-HT
Per Unit
$1.93
RFQ
1,446
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 8POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 8 (2 x 4) Beryllium Copper Flash Brass
Default Photo
Per Unit
$5.14
RFQ
1,961
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.14
RFQ
2,355
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 24 (2 x 12) Beryllium Copper 29.5µin (0.75µm) Brass
Default Photo
Per Unit
$5.10
RFQ
677
Ships today + free overnight shipping
On Shore Technology Inc. CONN IC DIP SOCKET 64POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 64 (2 x 32) Beryllium Copper Flash Brass
Default Photo
Per Unit
$5.08
RFQ
1,551
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 24 (2 x 12) Beryllium Copper Flash Brass
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