- Operating Temperature :
- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (2)
- 13 (1 x 13) (1)
- 14 (2 x 7) (6)
- 15 (1 x 15) (2)
- 16 (1 x 16) (1)
- 16 (2 x 8) (7)
- 18 (2 x 9) (4)
- 20 (1 x 20) (4)
- 20 (2 x 10) (6)
- 20 (4 x 5) (2)
- 22 (2 x 11) (3)
- 24 (2 x 12) (7)
- 28 (2 x 14) (10)
- 28 (4 x 7) (2)
- 3 (1 x 3) (1)
- 32 (1 x 32) (2)
- 32 (2 x 16) (7)
- 32 (2 x 7, 2 x 9) (1)
- 32 (4 x 8) (1)
- 4 (2 x 2) (1)
- 40 (2 x 20) (6)
- 44 (4 x 11) (1)
- 48 (2 x 24) (1)
- 52 (4 x 13) (2)
- 6 (2 x 3) (2)
- 68 (4 x 17) (2)
- 8 (2 x 4) (6)
- 84 (4 x 21) (2)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
92 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
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1,396
Ships today + free overnight shipping
|
Samtec Inc. | CONN ADAPTER PLUG 28POS GOLD | APA | Active | Bulk | - | Through Hole | Solder | Open Frame | - | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 28 (2 x 14) | Phosphor Bronze | 20.0µin (0.51µm) | Phosphor Bronze | |||
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3,885
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,427
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
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3,264
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
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3,026
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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2,188
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | Flash | Beryllium Copper | |||
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|
3,942
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | Flash | Beryllium Copper | |||
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3,760
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 24 (2 x 12) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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1,188
Ships today + free overnight shipping
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Assmann WSW Components | CONN IC DIP SOCKET 10POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 10 (2 x 5) | Beryllium Copper | Flash | Brass | |||
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2,508
Ships today + free overnight shipping
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On Shore Technology Inc. | CONN SOCKET SIP 13POS GOLD | SBU | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 13 (1 x 13) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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1,608
Ships today + free overnight shipping
|
CNC Tech | CONN SOCKET PLCC 20POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | 20 (4 x 5) | Phosphor Bronze | - | Phosphor Bronze | |||
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656
Ships today + free overnight shipping
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Assmann WSW Components | CONN IC DIP SOCKET 10POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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1,282
Ships today + free overnight shipping
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CNC Tech | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 22 (2 x 11) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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1,286
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 20 (2 x 10) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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1,647
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 18POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 18 (2 x 9) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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1,806
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 16POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 16 (2 x 8) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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1,221
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,863
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,585
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
3,819
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
724
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 6POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 6 (2 x 3) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
1,136
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 18POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 18 (2 x 9) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
3,986
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 14POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 14 (2 x 7) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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3,876
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 8 (2 x 4) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
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1,146
Ships today + free overnight shipping
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3M | CONN SOCKET PLCC 84POS TIN | 8400 | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | 84 (4 x 21) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | |||
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2,044
Ships today + free overnight shipping
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3M | CONN SOCKET PLCC 68POS TIN | 8400 | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | 68 (4 x 17) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | |||
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3,882
Ships today + free overnight shipping
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3M | CONN SOCKET PLCC 52POS TIN | 8400 | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | 52 (4 x 13) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | |||
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2,690
Ships today + free overnight shipping
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3M | CONN SOCKET PLCC 44POS TIN | 8400 | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | 44 (4 x 11) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | |||
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1,932
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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3,584
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper |
