9 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
268-5401-52-1102JH
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RFQ
3,406
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper Beryllium Copper
268-5401-50-1102JH
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RFQ
2,908
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper Beryllium Copper
268-5401-11-1102JH
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RFQ
1,245
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper Beryllium Copper
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Per Unit
$29.11
RFQ
1,719
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TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper -
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Per Unit
$29.11
RFQ
2,617
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TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper -
280-5205-01
Per Unit
$101.54
RFQ
3,533
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3M CONN SOCKET QFN 80POS GOLD Textool™ Active Tray - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - Gold 80 (4 x 20) Beryllium Copper Beryllium Copper
268-5401-00-1102JH
Per Unit
$17.29
RFQ
884
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3M CONN SOCKET CLCC 68POS GOLD OEM Active Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper Beryllium Copper
ICA-314-SST
Per Unit
$1.56
RFQ
1,047
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Samtec Inc. CONN IC DIP SOCKET 14POS GOLD ICA Active Tray -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper Brass
288-4205-01
Per Unit
$115.71
RFQ
2,779
Ships today + free overnight shipping
3M CONN SOCKET QFN 88POS GOLD Textool™ Active Tray - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - Gold 88 (4 x 22) Beryllium Copper Beryllium Copper
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