Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
98 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$15.35
RFQ
1,346
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.86
RFQ
1,808
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
12-820-90C
Per Unit
$5.86
RFQ
1,085
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-212-31-018000
Per Unit
$4.25
RFQ
737
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 12POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
299-93-612-10-002000
Per Unit
$4.05
RFQ
775
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 12POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
299-87-612-10-002101
Per Unit
$2.62
RFQ
2,322
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
Default Photo
Per Unit
$2.59
RFQ
1,884
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
116-83-312-41-013101
Per Unit
$2.45
RFQ
2,912
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (2 x 6) Beryllium Copper - Brass
Default Photo
Per Unit
$2.43
RFQ
3,440
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.47
RFQ
2,364
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
116-83-312-41-011101
Per Unit
$1.44
RFQ
2,704
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (2 x 6) Beryllium Copper - Brass
116-87-312-41-004101
Per Unit
$1.35
RFQ
1,888
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
116-83-312-41-001101
Per Unit
$1.31
RFQ
2,692
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (2 x 6) Beryllium Copper - Brass
Default Photo
Per Unit
$1.31
RFQ
3,049
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.29
RFQ
2,646
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.33
RFQ
1,724
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.33
RFQ
2,504
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.33
RFQ
1,175
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.52
RFQ
2,569
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
Default Photo
Per Unit
$0.42
RFQ
892
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
114-87-312-41-117101
Per Unit
$0.42
RFQ
3,095
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
110-87-312-41-005101
Per Unit
$0.41
RFQ
1,647
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
115-87-312-41-001101
Per Unit
$0.36
RFQ
3,127
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
110-87-312-41-001101
Per Unit
$0.32
RFQ
602
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
Default Photo
Per Unit
$6.78
RFQ
1,776
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.78
RFQ
3,833
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.78
RFQ
2,913
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.65
RFQ
2,504
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.65
RFQ
2,460
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.65
RFQ
3,518
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
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