Contact Finish - Mating :
503 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
GET PRICE
RFQ
1,547
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
AR24-HZL-TT
GET PRICE
RFQ
2,967
Ships today + free overnight shipping
Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-640361-4
GET PRICE
RFQ
3,285
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 24 (2 x 12) Beryllium Copper 15.0µin (0.38µm) Beryllium Copper
24-516-10
GET PRICE
RFQ
1,927
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
3,513
Ships today + free overnight shipping
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
1,249
Ships today + free overnight shipping
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
1,130
Ships today + free overnight shipping
Amphenol FCI CONN IC DIP SOCKET 24POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
915
Ships today + free overnight shipping
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
2,180
Ships today + free overnight shipping
3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 24 (2 x 12) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
2,373
Ships today + free overnight shipping
3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 24 (2 x 12) Beryllium Copper Flash Brass
1-1825109-1
GET PRICE
RFQ
2,375
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
3,122
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 24 (2 x 12) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
Default Photo
Per Unit
$66.02
RFQ
2,523
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$66.02
RFQ
1,753
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$63.48
RFQ
3,437
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$63.48
RFQ
2,318
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
2,054
Ships today + free overnight shipping
3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 24 (2 x 12) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
1,985
Ships today + free overnight shipping
3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 24 (2 x 12) Beryllium Copper Flash Brass
1-1825094-7
GET PRICE
RFQ
2,018
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
AR24-HZL/7/07-TT
GET PRICE
RFQ
2,006
Ships today + free overnight shipping
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL/07-TT
GET PRICE
RFQ
2,286
Ships today + free overnight shipping
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL/7/01-TT
GET PRICE
RFQ
769
Ships today + free overnight shipping
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL/01-TT
GET PRICE
RFQ
3,977
Ships today + free overnight shipping
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
1,361
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641932-2
GET PRICE
RFQ
2,592
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641933-1
GET PRICE
RFQ
2,022
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper - Beryllium Copper
2-641604-2
GET PRICE
RFQ
1,734
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$33.21
RFQ
3,670
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$27.56
RFQ
3,982
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$27.56
RFQ
3,013
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Page 1 / 17