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4 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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2,043
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,249
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (1 x 26) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
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1,816
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Harwin Inc. | CONN SOCKET SIP 26POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 26 (1 x 26) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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2,873
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 26POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
