- Series :
- Part Status :
- Mounting Type :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
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20 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,094
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | |||
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GET PRICE |
1,269
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Harwin Inc. | CONNECTOR | D01-993 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder Cup | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (1 x 32) | Brass | - | ||
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1,964
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | |||
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1,057
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | |||
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2,947
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Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | |||
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3,308
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | |||
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1,937
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | |||
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3,319
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | |||
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3,755
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | |||
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3,239
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Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | |||
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1,518
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | |||
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2,946
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | |||
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2,784
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
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3,428
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | |||
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1,224
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
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2,249
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | |||
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2,166
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | |||
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1,408
Ships today + free overnight shipping
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TE Connectivity AMP Connectors | CONN TRANSIST TO-5 4POS GOLD | 8058 | Active | Bulk | -55°C ~ 125°C | Panel Mount | Solder Cup | - | Transistor, TO-5 | Polytetrafluoroethylene (PTFE) | - | Gold | - | 4 (Round) | Beryllium Copper | - | |||
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3,334
Ships today + free overnight shipping
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TE Connectivity AMP Connectors | CONN TRANSIST TO-5 8POS GOLD | 8058 | Active | Bulk | -55°C ~ 125°C | Panel Mount | Solder Cup | - | Transistor, TO-5 | Polytetrafluoroethylene (PTFE) | - | Gold | - | 8 (Round) | Beryllium Copper | - | |||
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1,730
Ships today + free overnight shipping
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Harwin Inc. | CONN SOCKET SIP 32POS TIN | D01-993 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder Cup | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (1 x 32) | Brass | - |
