Number of Positions or Pins (Grid) :
8 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$10.44
RFQ
797
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$10.44
RFQ
3,240
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$8.95
RFQ
2,368
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.95
RFQ
3,681
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.87
RFQ
2,359
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.87
RFQ
669
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.65
RFQ
720
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.65
RFQ
3,214
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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