34 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
876
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,860
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,176
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,187
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,435
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,550
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,989
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS TIN - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 10 (2 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.37
RFQ
3,025
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.28
RFQ
2,302
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.26
RFQ
2,895
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.50
RFQ
829
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
D2928-42
Per Unit
$2.45
RFQ
788
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Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
D2818-42
Per Unit
$1.31
RFQ
1,589
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.67
RFQ
1,905
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.58
RFQ
1,527
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D26 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.58
RFQ
959
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.57
RFQ
779
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.66
RFQ
1,637
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D26 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.61
RFQ
3,164
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.60
RFQ
967
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.72
RFQ
1,499
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.72
RFQ
2,912
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
D0816-42
Per Unit
$2.81
RFQ
1,469
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.98
RFQ
2,933
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.97
RFQ
2,736
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D26 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
D2820-42
Per Unit
$1.43
RFQ
1,237
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
D0808-42
Per Unit
$1.38
RFQ
1,405
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
D2814-42
Per Unit
$1.04
RFQ
3,181
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
D2808-42
Per Unit
$0.86
RFQ
1,051
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.22
RFQ
960
Ships today + free overnight shipping
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D26 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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