- Operating Temperature :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
27 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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896
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
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2,473
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
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1,123
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
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2,963
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
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3,030
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
|
2,819
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
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2,278
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
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2,219
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | ||||
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2,735
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
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1,018
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
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3,444
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
|
2,311
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
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3,691
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
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1,085
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
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2,759
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | ||||
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2,181
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | ||||
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3,376
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | ||||
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3,934
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | ||||
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3,656
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | ||||
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2,357
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | ||||
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1,548
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
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1,037
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
|
3,307
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
|
977
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
|
2,229
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
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3,282
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 28 (2 x 14) | Beryllium Copper | ||||
|
2,026
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper |