- Manufacture :
- Series :
- Operating Temperature :
- Termination :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
- Contact Material - Post :
77 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,456
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Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,908
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,218
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Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,867
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,837
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,019
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,973
Ships today + free overnight shipping
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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2,774
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,593
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,327
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,159
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,361
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,778
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,594
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,267
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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3,004
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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2,924
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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2,536
Ships today + free overnight shipping
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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729
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 52POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 52 (2 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,976
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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3,442
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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3,981
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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2,023
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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2,500
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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880
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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1,599
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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2,392
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,194
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,396
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,066
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass |
