Number of Positions or Pins (Grid) :
2 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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Per Unit
$5.14
RFQ
2,355
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 24 (2 x 12) Beryllium Copper Brass
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Per Unit
$3.75
RFQ
2,814
Ships today + free overnight shipping
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 22POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 22 (2 x 11) Beryllium Copper Brass
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