Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
383 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,547
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,573
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
728
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,185
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,890
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,060
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,934
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
857
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TINLEAD - Obsolete - - Through Hole, Right Angle, Horizontal - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 28 (2 x 14) - - -
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RFQ
986
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
299-43-640-10-002000
Per Unit
$20.25
RFQ
1,165
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$28.56
RFQ
668
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD - Active Tube - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper - Brass
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Per Unit
$17.87
RFQ
3,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper - Brass
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RFQ
774
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete - - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper - Brass
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RFQ
2,805
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper - Brass
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Per Unit
$13.89
RFQ
2,254
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$13.89
RFQ
3,472
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$13.89
RFQ
2,243
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
299-93-626-10-002000
Per Unit
$16.48
RFQ
1,567
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 26POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$13.86
RFQ
1,696
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
299-93-608-10-002000
Per Unit
$13.56
RFQ
1,300
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$17.11
RFQ
3,779
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
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Per Unit
$12.97
RFQ
3,116
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$12.97
RFQ
3,747
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$12.97
RFQ
1,572
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$12.40
RFQ
2,797
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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Per Unit
$12.40
RFQ
3,326
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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Per Unit
$12.33
RFQ
2,740
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Aries Electronics CONN IC DIP SOCKET 34POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$12.33
RFQ
1,533
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$12.33
RFQ
2,762
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$12.31
RFQ
3,299
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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