6 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$6.03
RFQ
1,520
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.55
RFQ
1,680
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.77
RFQ
3,081
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.03
RFQ
2,014
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.22
RFQ
3,385
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.68
RFQ
3,910
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Page 1 / 1