Contact Finish - Mating :
Number of Positions or Pins (Grid) :
10 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
28-516-10
GET PRICE
RFQ
2,644
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper
24-516-10
GET PRICE
RFQ
1,927
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper
40-516-10
GET PRICE
RFQ
3,434
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
Default Photo
Per Unit
$11.10
RFQ
2,929
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
28-516-11
Per Unit
$10.51
RFQ
1,991
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper
Default Photo
Per Unit
$9.72
RFQ
2,419
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper
Default Photo
Per Unit
$9.04
RFQ
2,758
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper
Default Photo
Per Unit
$9.04
RFQ
2,182
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper
24-516-11
Per Unit
$9.04
RFQ
2,858
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper
40-516-11
Per Unit
$11.79
RFQ
2,933
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 516 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
Page 1 / 1