11 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
268-5401-52-1102JH
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RFQ
3,406
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper
268-5401-50-1102JH
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RFQ
2,908
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper
268-5401-11-1102JH
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RFQ
1,245
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper
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RFQ
906
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3M CONN SOCKET PQFP 100POS TIN-LEAD OEM Obsolete Bulk 0°C ~ 105°C Through Hole Solder Open Frame QFP Polyethersulfone (PES), Glass Filled - Tin-Lead 200.0µin (5.08µm) 100 (4 x 25) Beryllium Copper
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RFQ
2,161
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3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 40 (2 x 20) Beryllium Copper
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RFQ
806
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3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 20 (2 x 10) Beryllium Copper
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Per Unit
$13.00
RFQ
2,368
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3M CONN SOCKET PLCC 84POS GOLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold Flash 84 (4 x 21) Beryllium Copper
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Per Unit
$10.57
RFQ
994
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3M CONN IC DIP SOCKET ZIF 32POS GLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 32 (2 x 16) Beryllium Copper
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Per Unit
$10.51
RFQ
1,020
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3M OEM LCC SOCKETS 32 POS SOLID LID OEM Active - - - - - - - - - - - -
268-5401-00-1102JH
Per Unit
$17.29
RFQ
884
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3M CONN SOCKET CLCC 68POS GOLD OEM Active Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper
216-6278-00-3303
Per Unit
$10.71
RFQ
2,072
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3M CONN IC DIP SOCKET ZIF 16POS GLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 16 (2 x 8) Beryllium Copper
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