60 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$24.93
RFQ
3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$36.70
RFQ
1,964
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$35.75
RFQ
1,057
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$35.73
RFQ
2,947
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$30.52
RFQ
3,308
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$40.18
RFQ
1,937
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$38.88
RFQ
3,319
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$32.74
RFQ
3,755
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$20.12
RFQ
1,211
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$20.12
RFQ
632
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$37.08
RFQ
3,239
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$32.48
RFQ
1,518
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$27.63
RFQ
2,946
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$27.21
RFQ
2,784
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$23.51
RFQ
3,428
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 24POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$18.31
RFQ
3,493
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$21.55
RFQ
2,771
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$21.55
RFQ
1,224
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 24POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$15.22
RFQ
2,751
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$15.22
RFQ
657
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$19.19
RFQ
3,488
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$19.19
RFQ
1,056
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$15.19
RFQ
2,036
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$15.19
RFQ
3,599
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$16.99
RFQ
2,831
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$16.99
RFQ
1,580
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.96
RFQ
3,503
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$34.63
RFQ
2,249
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$12.43
RFQ
3,683
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$12.43
RFQ
2,200
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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