- Mounting Type :
- Termination :
- Contact Finish Thickness - Mating :
4 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,876
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 8 (2 x 4) | Beryllium Copper | Beryllium Copper | |||
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2,191
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | Beryllium Copper | |||
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3,652
Ships today + free overnight shipping
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 8 (2 x 4) | Beryllium Copper | Beryllium Copper | |||
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3,856
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | Brass |
