15 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$7.59
RFQ
2,139
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$5.92
RFQ
672
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.63
RFQ
1,004
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$4.61
RFQ
3,044
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.69
RFQ
2,055
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.28
RFQ
1,752
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.89
RFQ
3,642
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.46
RFQ
2,749
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.46
RFQ
2,938
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.18
RFQ
2,683
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.80
RFQ
3,683
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.78
RFQ
728
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.68
RFQ
1,812
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.64
RFQ
1,935
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.36
RFQ
3,210
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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