Packaging :
Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Contact Material - Mating :
3 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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RFQ
1,749
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper Beryllium Copper
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RFQ
1,373
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 32 (2 x 16) Phosphor Bronze Phosphor Bronze
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Per Unit
$5.72
RFQ
1,228
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS - Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) - - - 28 (2 x 14) Beryllium Copper Copper
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