13 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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RFQ
3,261
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Omron Electronics Inc-EMC Div CONN IC SOCKET 20POS XR2 Obsolete Bulk -55°C ~ 125°C - Solder Closed Frame Housing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) - - 20 (1 x 20) Beryllium Copper
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RFQ
2,390
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (1 x 32) Beryllium Copper
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Per Unit
$4.29
RFQ
3,427
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper
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Per Unit
$2.66
RFQ
3,026
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper
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Per Unit
$4.38
RFQ
2,585
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (1 x 32) Beryllium Copper
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Per Unit
$1.62
RFQ
3,584
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper
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Per Unit
$3.16
RFQ
1,586
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper
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Per Unit
$1.51
RFQ
676
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (1 x 16) Beryllium Copper
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Per Unit
$2.06
RFQ
2,846
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Omron Electronics Inc-EMC Div CONN ZIG-ZAG 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper
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Per Unit
$1.75
RFQ
975
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper
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Per Unit
$1.74
RFQ
3,850
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper
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Per Unit
$0.17
RFQ
1,873
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Omron Electronics Inc-EMC Div CONN IC SOCKET 32POS XR2 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame Housing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) - - 32 (1 x 32) Beryllium Copper
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Per Unit
$0.43
RFQ
3,627
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 3POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 3 (1 x 3) Beryllium Copper
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