- Series :
- Part Status :
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- Pitch - Mating :
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7 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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1,446
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3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||
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959
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3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||
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GET PRICE |
1,853
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||
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GET PRICE |
3,138
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||
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1,809
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,685
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,072
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3M | CONN IC DIP SOCKET ZIF 16POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 16 (2 x 8) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper |
