4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
216-7383-55-1902
Per Unit
$25.25
RFQ
1,809
Ships today + free overnight shipping
3M CONN SOCKET SOIC 16POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 16 (2 x 8) Beryllium Copper
216-7224-55-1902
Per Unit
$25.24
RFQ
2,685
Ships today + free overnight shipping
3M CONN SOCKET SOIC 16POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 16 (2 x 8) Beryllium Copper
216-6278-00-3303
Per Unit
$10.71
RFQ
2,072
Ships today + free overnight shipping
3M CONN IC DIP SOCKET ZIF 16POS GLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 16 (2 x 8) Beryllium Copper
216-3340-00-0602J
Per Unit
$17.27
RFQ
3,767
Ships today + free overnight shipping
3M CONN IC DIP SOCKET ZIF 16POS GLD Textool™ Active Tube -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper
Page 1 / 1