- Part Status :
- Features :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
9 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,406
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3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | ||
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GET PRICE |
2,908
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|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | ||
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GET PRICE |
1,245
Ships today + free overnight shipping
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | ||
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2,161
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3M | CONN IC DIP SOCKET ZIF 40POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 40 (2 x 20) | Beryllium Copper | ||
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806
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3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 20 (2 x 10) | Beryllium Copper | ||
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2,368
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3M | CONN SOCKET PLCC 84POS GOLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | PLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 84 (4 x 21) | Beryllium Copper | |||
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994
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3M | CONN IC DIP SOCKET ZIF 32POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 32 (2 x 16) | Beryllium Copper | |||
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884
Ships today + free overnight shipping
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3M | CONN SOCKET CLCC 68POS GOLD | OEM | Active | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | |||
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2,072
Ships today + free overnight shipping
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3M | CONN IC DIP SOCKET ZIF 16POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 16 (2 x 8) | Beryllium Copper |
